Informazioni di Base
- Model No.: single sided pcb
- Tipo : Circuito rigido
- Flame Retardant Proprietà : V0
- Dielettrico : FR-4
- Materiale : In fibra di vetro epossidico
Informazioni Aggiuntive..
- Trademark: OEM
- Packing: Anti-Static Bag & Foam & Carton
- Standard: ROHS, UL, ISO, IPC
- Origin: China, Shenzhen
- Production Capacity: 10000PCS Per Month
Descrizione del prodotto
Scegliere le componenti rivestite di DIP, del PWB che saldano a mano da un lato e la macchina. controllo visivo elettronico della prova di 100% e di 100% e 100% prove di saldatura.
Wells Electronic Technology Ltd. stabilito in 2000, situato nel più grande mercato elettronico a mondo-Shenzhen. Con 14 anni di esperienza, offerta di Wells Electronic Technology Ltd. voi disposizione del PWB, fabbricazione del PWB, installazione del PWB, installazione di cablaggio del collegare, CI che programma, sourcing delle componenti,
Prova di PCBA Functional, ecc.
| PCB Assembly Capability | ||
| Items | Capability | |
| 1 | Min. IC Pitch | 0.30mm(12mil) |
| 2 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
| 3 | Min. Chip Placement | 01005 |
| 4 | Max. PCB Size | 410mm x 600mm(16.2" x 23.6") |
| 5 | Min. PCB Thickness | 0.35mm(13.8mil) |
| 6 | Maximum BGA Size | 74mm x 74mm(2.9" x 2.9") |
| 7 | BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) |
| 8 | BGA Ball Diameter | 0.4mm ~ 1mm(16mil ~ 40mil) |
| 9 | QFP Lead Pitch | 0.38mm ~ 2.54mm(15mil ~ 100mil) |
| 10 | Package | Anti-static Bubble Bag & Carton |
| PCB Capability | ||
| Items | Capability | |
| 1 | Layers | 1 ~ 30 layers |
| 2 | Base Material | FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium |
| 3 | Finished Board Thickness | 0.2mm ~ 7.0mm(8mil-276mil) |
| 4 | Aspect Ratio | 10:1 |
| 5 | Copper Thickness | 1/3oz ~ 7oz |
| 6 | Surface Finishing | HASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc. |
| 7 | Max gold plating thickness | 50 microinch |
| 8 | Min. Trace Width/Space | 0.075/0.075mm(3/3mil) |
| 9 | Min. Finish Holes Size | 0.1mm(4mil) for laser holes; 0.2mm(8mil) for mechanical holes |
| 10 | Max.Finshed Size | 600mm x 900mm (23.6" x 35.43") |
| 11 | Hole Tolerance | PTH:±0.076mm(+/-3mil), NTPH:±0.05mm(+/-2mil) |
| 12 | Soldermask Color | Green, White, Black, Red, Yellow, Blue, |
| 13 | Silkscreen Color | White, Black, Yellow, Blue |
| 14 | Impedance Control | +/-10% |
| 15 | Profiling Punching | Routing, V-CUT, Chamfer |
| 16 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 17 | Special Holes | Blind/Buried holes, Countersunk holes |
| 18 | Reference Standard | IPC-A-600H Class 2, Class 3, TS16949 |
| 19 | Certificate | UL, ISO9001, ROHS, SGS |
| 20 | Package | Vacuum & Carton |
| FPC Capability | ||
| Items | Capability | |
| 1 | Types | Single-sided, Double-sided, Multi-layers (max 6 layers) and Flex-Rigid PCB |
| 2 | Surface Finishing | HASL(LF), Gold plating, Electroless nickel immersion gold,Immersion Tin, OSP(Entek) |
| 3 | Base Material | Polyimide(Kapton), Polyester(PET), FR4 |
| 4 | Copper Foil | ED/RA |
| 5 | Min. Line Width | 0.05mm(2 mil) |
| 6 | Min. Line Spacing | 0.05mm(2 mil) |
| 7 | Min. Hole Size | 0.2mm(8mil) |
| 8 | Max. Board Size | 400mm x 800mm(15.8" x 31.5") |
| 9 | Min. Board Thickness | 0.1mm(4mil) |
| 10 | Min. Solder Mask Thickness | 10um(0.4mil) |
| 11 | Solder Mask Types | Green, Yellow, Black, White, Blue, Red, Clear |
| 12 | Profiling | Punching, Routing, V-cut |
| 13 | Soldering Thermal Resistance | 300°C/10 seconds |
| 14 | Peeling Strength | ≥1.4kg/cm |
| 15 | Surface Resistance | 105mΩ |
| 16 | Insulation Resistance | 105mΩ |
| 17 | Dielectric Strength | 9.8x105v/cm |
| 18 | Flammability | UL-94V-0 |
| 19 | Performance Test | 100% electrical and electricity performance test |
Tipi dei prodotti
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